Manufacturing

Glass Manufacturing Plant

We offer customers a consistent and reliable glass processing and toughening service, with every machine technology in-house operated by fully trained, skilled technicians, enabling us to fulfil your requirements on time – a routine we are proud of.

We have the facility to offer a rapid turnaround service for builders, contractors, shop fitters, architects and project managers.

We have the flexibility to manufacture to order and will be delighted to welcome your trade enquiry and request for an urgent quotation.

  • State-of-the-art Water Jet Cutting Equipment
  • Toughening Glass Processing Plant with Hot Ovens and Cool Air Extractors
  • Edging Workstation

Key benefits

  • Fast, efficient turnaround
  • Toughen from 4 – 19mm and up to 3600 x 2100
  • All products to Australian Standards
  • CSI Certification

Glass Toughening

We have invested in a new toughening furnace and cooling extractor system.

We now have the facility to offer a rapid turnaround service for builders, contractors, shop fitters, architects and project managers.

We have the flexibility to manufacture to order and will be delighted to welcome your trade enquiry and request for an urgent quotation.

Our furnace produces toughened glass of the highest quality.

Thickness: from 4mm and up to 12mm.

Sizes: up to a maximum of 2100mm x 3600mm.

Product Range: glass panels, facades, screens and worktops.

Waterjet Cutting Technology

Due to its versatility and ease of operation, water jet cutting has revolutionised the glass and glazing industry’s capabilities.

It has given us the capability to handle complex and intricate glass cutting contracts, and quickly move from job to job.

We can undertake virtually any finished shape required and cut to bespoke designs, or mass production.

Working to its maximum capacity, our water jet cutting machine can turn around well over 100 intricate glass pieces per day.

It can produce EXCEPTIONAL QUALITY without ever inducing heat-affected zones of mechanical stresses in glass: the process has eliminated the need for costly secondary finishing.

Computer Controlled

ROBOTIC NOTION systems to facilitate an infinite variety of shape cutting.

The immediate effect has been the abandoning of a need for costly hand-tool changes during a complex cutting process.

Cutting

The water jet cuts with EROSION: water is pumped – at a pressure of 55,000 psi – continuously into a supersonic water jet stream, making it possible to cut through composites such as stone and thick glass.

Edging Workstation

This machine polishes glass edges. Mainly used for mirrors, glass doors, shelves etc. It gives a clean and highly polished finished edge.

Toughened Glass Silvering DC Sputtering Machine

What is DC Sputtering?

DC or Direct Current Sputtering is a Thin Film Physical Vapor Deposition (PVD) Coating technique where a target material to be used as the coating is bombarded with ionized gas molecules causing atoms to be “Sputtered” off into the plasma. These vaporized atoms are then deposited when they condense as a thin film on the substrate to be coated.

DC Sputtering is the most basic and inexpensive type of sputtering for PVD metal deposition and electrically conductive target coating materials. Two major advantages of DC as a power source for this process is that it is easy to control and is a low cost option if you are doing metal deposition for coating.

DC Sputtering is used extensively in the semiconductor industry creating microchip circuitry on the molecular level. It is used for gold sputter coatings of jewellery, watches and other decorative finishes, for non-reflective coatings on glass and optical components, as well as for metalized packaging plastics.

The basic configuration of a DC Sputtering coating system is the target material to be used as a coating is placed in a vacuum chamber parallel to the substrate to be coated.

The vacuum chamber is evacuated to a base pressure removing H2O, Air, H2, AR and then backfilled with a high purity inert process gas – usually Argon due to its relative mass and ability to convey kinetic energy upon impact during high energy molecular collisions in the plasma that creates the gas ions that are the primary driving force of sputter thin film deposition. Typical sputter pressures range from 0.5mTorr to 100mTorr

A DC electrical current typically in the -2 to -5 kV range is then applied to the target coating material that is the cathode or point at which electrons enter the system known as the negative bias.

The electrically neutral argon gas atoms are first ionized as a result of the forceful collision of these gas atoms onto the surface of the negatively charged target which eject atoms off into the plasma – a hot gas‐like state consisting of roughly half gas ions and half electrons that emits the visible plasma glow.

The ionized argon gas atoms are then driven to the substrate which is the anode or positive charged bias attracting ionized gas ions, electrons and the vaporized target coating atoms which condense and form a thin film coating on the substrate to be coated. DC Magnetron sputtering uses magnets behind the negative cathode to trap electrons over the negatively charged target material, so they are not free to bombard the substrate, allowing for faster deposition rates.

The magnetic field forms a boundary "tunnel" which traps electrons near the surface of the target that improves the efficiency of the gas ion formation. DC Magnetron Sputtering allows for higher current at lower gas pressure that achieves an even higher thin film deposition rate.

FAQs